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Mount | Surface Mount |
---|---|
Max Supply Voltage | 3.6V |
Memory Type | ROM, SRAM |
Radiation Hardening | No |
Package / Case | 176-LQFP |
Technology | CMOS |
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Core Architecture | Blackfin |
Terminal Form | GULL WING |
Number of Pins | 176 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Operating Temperature | -40°C~85°C TA |
Bit Size | 32 |
Mounting Type | Surface Mount |
Pin Count | 176 |
Number of UART Channels | 1 |
Memory Size | 84kB |
Packaging | Tray |
Terminal Pitch | 0.5mm |
Number of Programmable I/O | 16 |
Non-Volatile Memory | ROM (1kB) |
Min Supply Voltage | 800mV |
Terminal Position | QUAD |
Number of Terminations | 176 |
Supply Voltage | 1.2V |
Height | 1.4mm |
Width | 24mm |
Lead Free | Contains Lead |
Pbfree Code | no |
RoHS Status | ROHS3 Compliant |
Data Bus Width | 16b |
RAM Size | 32kB |
REACH SVHC | No SVHC |
Additional Feature | ALSO REQUIRES 3V OR 3.3V SUPPLY |
Low Power Mode | YES |
Boundary Scan | YES |
Barrel Shifter | YES |
JESD-609 Code | e3 |
Factory Lead Time | 12 Weeks |
Number of Timers/Counters | 4 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Peak Reflow Temperature (Cel) | 260 |
Series | Blackfin® |
Internal Bus Architecture | MULTIPLE |
Type | Fixed Point |
Length | 24mm |
Subcategory | Microprocessors |
Contact Plating | Tin |
Part Status | Active |
Voltage - Core | 1.20V |
Frequency | 400MHz |
Voltage - I/O | 3.30V |
Interface | SPI, SSP, UART |
Base Part Number | ADSP-BF532 |
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