1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
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Mount | Surface Mount |
---|---|
Max Supply Voltage | 3.6V |
Density | 8 Mb |
Radiation Hardening | No |
Height Seated (Max) | 1.7mm |
Package / Case | 316-LFBGA, CSPBGA |
Technology | CMOS |
Address Bus Width | 20 |
Lifecycle Status | PRODUCTION (Last Updated: 1 week ago) |
Core Architecture | Blackfin |
Terminal Form | BALL |
Number of Pins | 316 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Operating Temperature | -40°C~85°C TA |
On Chip Data RAM | 148kB |
Bit Size | 32 |
Mounting Type | Surface Mount |
Pin Count | 316 |
Clock Rate | 400MHz |
Number of UART Channels | 3 |
Memory Size | 1MB |
Packaging | Tray |
Terminal Pitch | 0.8mm |
Non-Volatile Memory | FLASH (1MB) |
Min Supply Voltage | 800mV |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Position | BOTTOM |
Number of Terminations | 316 |
Supply Voltage | 1.2V |
Lead Free | Contains Lead |
Pbfree Code | no |
RoHS Status | ROHS3 Compliant |
Speed | 400 MHz |
Data Bus Width | 16b |
RAM Size | 32kB |
REACH SVHC | No SVHC |
Low Power Mode | YES |
Boundary Scan | YES |
Number of I/O | 54 |
Barrel Shifter | YES |
JESD-609 Code | e1 |
Factory Lead Time | 8 Weeks |
Time@Peak Reflow Temperature-Max (s) | 40 |
Peak Reflow Temperature (Cel) | 260 |
Series | Blackfin® |
Internal Bus Architecture | MULTIPLE |
Type | Fixed Point |
Length | 17mm |
Subcategory | Microprocessors |
Contact Plating | Copper, Silver, Tin |
Part Status | Active |
Voltage - Core | 1.20V |
Frequency | 533MHz |
Voltage - I/O | 3.00V 3.30V |
Interface | CAN, SPI, SSP, TWI, UART |
Base Part Number | ADSP-BF538 |
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