1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
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Mount | Surface Mount |
---|---|
Max Supply Voltage | 3.6V |
Memory Type | ROM, SRAM |
Package / Case | 400-LFBGA, CSPBGA |
Technology | CMOS |
Core Architecture | Blackfin |
Terminal Form | BALL |
Number of Pins | 400 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Operating Temperature | -40°C~85°C TA |
HTS Code | 8542.31.00.01 |
On Chip Data RAM | 196kB |
Bit Size | 32 |
Mounting Type | Surface Mount |
Power Supplies | 1.22.5/3.3V |
Pin Count | 400 |
Memory Size | 260kB |
Packaging | Tray |
Terminal Pitch | 0.8mm |
Non-Volatile Memory | External |
Min Supply Voltage | 900mV |
Terminal Finish | TIN SILVER COPPER |
Terminal Position | BOTTOM |
Number of Terminations | 400 |
Supply Voltage | 1.25V |
Height | 1.7mm |
ECCN Code | 5A992.C |
Width | 17mm |
Lead Free | Contains Lead |
Qualification Status | Not Qualified |
Pbfree Code | no |
RoHS Status | ROHS3 Compliant |
Data Bus Width | 16b |
RAM Size | 64kB |
Low Power Mode | YES |
Boundary Scan | YES |
Number of I/O | 152 |
Barrel Shifter | YES |
JESD-609 Code | e1 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Peak Reflow Temperature (Cel) | 260 |
Series | Blackfin® |
Internal Bus Architecture | MULTIPLE |
Type | Fixed Point |
Length | 17mm |
Subcategory | Microprocessors |
Contact Plating | Copper, Silver, Tin |
Part Status | Obsolete |
Voltage - Core | 1.25V |
Frequency | 533MHz |
Voltage - I/O | 2.50V 3.30V |
Interface | CAN, SPI, SSP, TWI, UART |
Base Part Number | ADSP-BF544 |
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