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BR25G256F-3GE2

Part No BR25G256F-3GE2
Manufacturer LAPIS Semiconductor
Description SPI BUS EEPROM
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Data sheet

Package / Case:8-SOIC (0.173", 4.40mm Width)
Mounting Type:Surface Mount
Packaging:Original-Reel®
Supplier Device Package:8-SOP
Memory Type:Non-Volatile
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:EEPROM Memory IC 256Kb (32K x 8) SPI 20MHz 8-SOP
Voltage - Supply:1.6 V ~ 5.5 V
Clock Frequency:20MHz
Memory Size:256Kb (32K x 8)
Memory Interface:SPI
Write Cycle Time - Word, Page:5ms
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:11 Weeks
Email:info@shengyuic.com
Series:-
Other Names:BR25G256F-3GE2DKR
Memory Format:EEPROM
Technology:EEPROM
Operating Temperature:-40°C ~ 85°C (TA)

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