sale@shengyuic.com
| 1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
|---|---|---|---|---|---|---|
| Uni Price | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
|---|---|
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Surface Mount | YES |
| Terminal Position | BOTTOM |
| Package / Case | 625-BFBGA, FCBGA |
| Technology | CMOS |
| JESD-30 Code | R-PBGA-B625 |
| Terminal Form | BALL |
| Number of Terminations | 625 |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage | 0.85V |
| RoHS Status | ROHS3 Compliant |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Operating Temperature | -40°C~100°C TJ |
| HTS Code | 8542.31.00.01 |
| Supply Voltage-Min (Vsup) | 0.825V |
| Architecture | MCU, FPGA |
| RAM Size | 256KB |
| Number of I/O | 180 |
| Peripherals | DMA, WDT |
| Factory Lead Time | 11 Weeks |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray |
| Part Status | Active |
| Published | 2013 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Xilinx
FPGA Zynq UltraScale+ Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
sale@shengyuic.com
Room 305A, ShangHang Building, NO.23 Building , ShangBu Industrial Zone, Hongli Road, Futian, Shenzhen China, 518028! Contact Us Now!