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HF115AC-0.0055-AC-105
the part number is HF115AC-0.0055-AC-105
Part
HF115AC-0.0055-AC-105
Manufacturer
Description
THERM PAD 36.83MMX21.29MM W/ADH
Lead Free/ROHS
pb RoHs
Datasheets
CAD Models
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Specification
Thermal Conductivity: 0.8 W/m-K
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Detailed Description: Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side
Adhesive: Adhesive - One Side
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Manufacturer Standard Lead Time: 2 Weeks
Shape: Rectangular
Thermal Resistivity: 0.35°C/W
Email: sale@shengyuic.com
Outline: 36.83mm x 21.29mm
Color: Gray
Series: Hi-Flow® 115-AC
Usage: SIP
Type: Pad, Sheet
Thickness: 0.0055" (0.140mm)
Other Names: BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105
Material: Phase Change Compound
Backing, Carrier: Fiberglass
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